MEMS Manufacturing Technology
Protron Mikrotechnik works with all standard MEMS processes for silicon micromachining. Furthermore we use state of the art equipment for test and characterisation to offer processes and products with best possible quality.
Our Technologies
- 100mm and 150mm wafer production line
- Photolithography
- minimum structure width 1µm
- Deposition and Thermal Processing
- Oxidation Diffusion, Annealing
- Low Pressure Chemical Vapor Deposition
- Plasma Enhanced Chemical Vapor Deposition
- Sputtering, Evaporation
- Electroplating
- Etching
- Deep Reactive Ion Etching
- Reactive Ion Etching
- Wet Etching
- Ion Milling Etching
- Wafer Bonding
- silicon fusion bonding
- anodic bonding
- eutectic bonding
- Assembly and Packaging Technology
- waferdicing
- chipbonding
- wirebonding
- Test and Characterisation
- wafer prober
- video inspection system
- laser scanning microscopy
- film-thickness measurement tools
- step height prober
- surface profiler
- film stress measurement system
- 4-point resistivity prober
- scanning electron microscope (SEM)
- pressure test chamber
- climatic exposure test cabinet
